NXP Semiconductors
LM75B
Digital temperature sensor and thermal watchdog
?NXP B.V. 2014.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 22 January 2014
Document identifier: LM75B
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section Legal information.
20. Contents
1
General description. . . . . . . . . . . . . . . . . . . . . . 1
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
4
Ordering information. . . . . . . . . . . . . . . . . . . . . 3
4.1
Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 3
5
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
6
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
6.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
6.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
7
Functional description . . . . . . . . . . . . . . . . . . . 5
7.1
General operation. . . . . . . . . . . . . . . . . . . . . . . 5
7.2
I
2
C-bus serial interface . . . . . . . . . . . . . . . . . . . 7
7.2.1
Bus fault time-out . . . . . . . . . . . . . . . . . . . . . . . 7
7.3
Slave address. . . . . . . . . . . . . . . . . . . . . . . . . . 7
7.4
Register list. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
7.4.1
Pointer register . . . . . . . . . . . . . . . . . . . . . . . . . 8
7.4.2
Configuration register . . . . . . . . . . . . . . . . . . . . 8
7.4.3
Temperature register . . . . . . . . . . . . . . . . . . . . 9
7.4.4
Overtemperature shutdown threshold
(Tos) and hysteresis (Thyst) registers. . . . . . . 10
7.5
OS output and polarity . . . . . . . . . . . . . . . . . . 11
7.6
OS comparator and interrupt modes . . . . . . . 11
7.7
OS fault queue . . . . . . . . . . . . . . . . . . . . . . . . 12
7.8
Shutdown mode . . . . . . . . . . . . . . . . . . . . . . . 12
7.9
Power-up default and power-on reset . . . . . . 12
7.10
Protocols for writing and reading the registers 13
8
Application design-in information . . . . . . . . . 16
8.1
Typical application . . . . . . . . . . . . . . . . . . . . . 16
8.2
LM75A and LM75B comparison . . . . . . . . . . . 16
8.3
Temperature accuracy . . . . . . . . . . . . . . . . . . 17
8.4
Noise effect. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 19
10
Recommended operating conditions. . . . . . . 19
11
Static characteristics. . . . . . . . . . . . . . . . . . . . 20
12
Dynamic characteristics . . . . . . . . . . . . . . . . . 22
13
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 23
14
Soldering of SMD packages . . . . . . . . . . . . . . 27
14.1
Introduction to soldering . . . . . . . . . . . . . . . . . 27
14.2
Wave and reflow soldering . . . . . . . . . . . . . . . 27
14.3
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 27
14.4
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 28
15
Soldering: PCB footprints. . . . . . . . . . . . . . . . 30
16
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 34
17
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 34
18
Legal information . . . . . . . . . . . . . . . . . . . . . . 35
18.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 35
18.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
18.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 35
18.4
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 36
19
Contact information . . . . . . . . . . . . . . . . . . . . 36
20
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
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